nx_polymer_thermal.nx

nx_polymer_thermal.nx -- per-polymer thermal envelope for FDM printing. Combines polymer chemistry (Tg, Tm, Td) with engineering constraints (recommended print + bed temp ranges) into a single substrate primitive the slicer composes for thermal-safety validation BEFORE emitting G-code with operator-supplied temps. Per META-CARDINAL feedback-engineering-sciences-bits-up-3d-print-first: this is the substrate's FIRST primitive that bridges Layer 2 (pure chemistry: nx_chem_periodic / nx_chem_molecule -- already shipped) with Layer 3 (engineering applications: nx_material_profile + nx_gcode_emit). Composes: - nx_material_profile (NX_MAT_* sealed-enum keys) - chemistry knowledge (Tg / Tm / Td values from polymer literature) Future v2 could compose nx_chem_molecule to compute mol weight from PLA repeating unit (C3H4O2)n etc., but v1 ships the slicer- relevant constants directly per material class. Thermal values verified against polymer-literature consensus: PLA: Tg 60°C / Tm 160°C / Td 250°C / print 190-230 / bed 50-65 PETG: Tg 80°C / Tm 240°C / Td 290°C / print 220-250 / bed 70-85 ABS: Tg 105°C / amorphous / Td 270°C / print 220-260 / bed 90-110 ASA: Tg 105°C / amorphous / Td 270°C / print 240-260 / bed 100-110 PC: Tg 145°C / amorphous / Td 320°C / print 270-310 / bed 110-130 TPU: Tg variable / Tm 180°C / Td 240°C / print 200-230 / bed 50-60 NYLON: Tg 50°C / Tm 220°C / Td 320°C / print 240-280 / bed 80-100 PA-CF: same as NYLON with reinforcement (no thermal delta) PEEK: Tg 143°C / Tm 343°C / Td 575°C / print 360-400 / bed 120-145 Amorphous polymers (ABS, ASA, PC) use Tm = 0 as sentinel meaning "no crystalline melt; soften gradually above Tg". Validator treats this case correctly. license_tier: ORIGINAL