nx_polymer_thermal_test.nx
buildroot/runtime/nx_polymer_thermal_test.nx
about
nx_polymer_thermal_test.nx -- per-polymer thermal envelope +
validator against operator-supplied temps.
Closed-form invariants (hand-verified per polymer literature):
(a) PLA envelope: Tg=60, Tm=160, Td=250, print 190-230, bed 50-65
(b) PETG envelope: Tg=80, Tm=240, Td=290, print 220-250, bed 70-85
(c) ABS envelope: amorphous (Tm=0), Td=270
(d) PEEK envelope: Td=575 (high-temp engineering polymer)
(e) Unknown material class returns NULL
(f) PLA at 210/60 -> SAFE
(g) PLA at 160/60 -> PRINT_TOO_LOW
(h) PLA at 260/60 -> DECOMP_RISK (260 > Td=250)
(i) PLA at 210/100 -> BED_TOO_HIGH (PLA bed max 65)
(j) ABS at 210/100 -> PRINT_TOO_LOW (ABS min 220)
(k) PETG at 235/80 -> SAFE
(l) Generic-PLA profile factory validates SAFE
expect_exit: 0
license_tier: ORIGINAL
dependencies 3 imports · 0 importers
imports: nx_syscalls.nxnx_material_profile.nxnx_polymer_thermal.nx
imported by: nobody (leaf or entry point)
call flow from main pre-order; caps 40 nodes / depth 6 declared; ↻ = already shown
structs
| none |
consts
| none |
functions
| 25 | func main() -> i64 |